According to a slide that Sandisk shared, HBF combines BiCS technology with CBA wafer bonding ... interfacing with a logic die and PHY, which then connects to a GPU, CPU, TPU, or SoC die.

Dice being singulated with a diamond saw The general plan is to use testing at a variety of points to improve overall quality, by weeding out bad wafers (PCM data) bad die (wafer probe ...

However, not all chips perform equally, even if they come from the same wafer. This is where chip binning comes in. After dicing, each die is tested and sorted based on factors like speed ...

which does rather beg the question of exactly how serendipitous the discovery of the wafer really was... But it's a fun discovery all the same. Best CPU for gaming: Top chips from Intel and AMD.