TSMC takes 'chip binning' to a whole new level as entire wafer 'found in a dumpster'
Chip binning' is supposed to be the process of testing newly manufactured silicon to see how many of the important bits work and how high the thing will clock. But TSMC seems to be taking the notion a ...
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ACM Research Qualifies New Single-Wafer High-Temperature SPM Tool for Leading Logic Device Manufacturer in China
ACM Research's new SPM tool enhances wafer processing efficiency and cleanliness, gaining qualification from a key Chinese semiconductor manufacturer. ACM Research, Inc. announced that its Single ...
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ACM Research Announces Qualification Of High-Temperature SPM Tool For Customer In China
It supports wet etching and wafer cleaning for both front- and back-end processes at 28-nanometer (nm) and below technology nodes. “The Single-Wafer Moderate/High-Temperature SPM tool is a prime ...