Rohm has announced that the EcoGaN series of 650V GaN HEMTs in the TOLL package has been adopted for AI server power supplies ...

Arizona-based Saras Micro Devices, a start-up focused on improving power performance using novel packaging, has announced its ...

Power Integrations has announced a two-fold increase in power output from the HiperLCS-2 chipset. Featuring half-bridge switch technology and an innovative new package, the device ...

SkyWater Technology has agreed to purchase Infineon’s 200 mm fab in Austin, Texas and with a corresponding long-term supply ...

The Compound Semiconductor Applications (CSA) Catapult has welcomed members of the UK government’s cabinet to its Innovation ...

Taiwan Semiconductor— a supplier of discrete power electronics devices, LED drivers, analogue ICs and ESD protection — has ...

The compound semiconductor market is set to reach $25 billion by 2030 according to market research firm Yole's latest report, ...

Clas-SiC Wafer Fab is the world’s first open foundry dedicated to SiC. At our facility, located in Lochgelly on the outskirts ...

The University of Sheffield's School of Electrical and Electronic Engineering in collaboration with Matrix TSL and ...

STMicroelectronics has announced the DCP3601, a 3.3V-to-36V input, 1A output miniature monolithic buck converter for powering ...

Farnell President, Rebeca Obregon, said, “Colin’s knowledge about electrification is vast, and he’s not known for pulling his ...

The CEO expects the majority of its sales over the next few years to come from domestic markets, but 30 percent will be ...