Additive Manufactured Electronics (AME) is rapidly emerging as a transformative alternative to traditional prototyping and ...

TSMC announces $100bn US investment including three new fabs, two advanced packaging facilities, and a major R&D centre.

The LV-45 linear position sensors are specifically designed for measuring applications requiring rugged devices, whether ...

TDK has announced the introduction of new multiple option configurations for the TDK-Lambda brand ZWS-C series.

Microchip Technology has announced plans to lay off workers at its Oregon and Colorado facilities, blaming weak sales and a ...

Pragmatic, a developer of flexible semiconductor technology, launches the Pragmatic FlexIC Platform Gen 3 for ASICs.

The UK-APAC Tech Growth Programme arranged a successful trade mission to South Korea by six UK technology businesses.

Atmosic, a developer of energy harvesting wireless platforms for the IoT, unveils a new SoC family and raises new funds.

Murata Manufacturing has announced the launch of the world’s first Digital Envelope Tracking (Digital ET) technology. This ...

While the delays have been attributed in part to rumours around a foundry split, delays in Intel’s Ohio fabs are also being ...

eMemory Technology, a developer of embedded non-volatile memory (eNVM) solutions, and its subsidiary PUFsecurity, a ...

STMicroelectronics has introduced the Teseo VI family of global navigation satellite system (GNSS) receivers aimed at ...