Intel has started using two leading-edge ASML High-NA Twinscan EXE:5000 EUV lithography tools, the company revealed on Monday at an industry conference, Reuters reports. The company uses these ...

The government and industry groups are working on reducing power and water costs as they aspire to put up the first wafer fabrication facility in the country and meet the “evolving” demands of ...

Front Opening Unified Pods (FOUPs) Market Analysis Report 2025: Size, Share, and Trends by Applications (Foundry, IDM), By Types (13 Pcs Capacity, 25 Pcs Capacity, Others), By Segmentation ...